The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.
Measurements on Copper are affected by the temperature of the sample. The CMI 165 accounts for temperature in the measurement of thickness ensuring accurate in-process inspection results regardless of Copper temperature. This versatile, portable gauge equipped with protective case, has a rugged and durable design that allows it to be taken into the harshest environments.
Measure hot or cold Cu on PCBs
Reduce waste by eliminating the need for coupons
Measure foil or laminated Cu thickness in μm,mils or oz
Sort Cu by weight at incoming drilling, shearing or plating
Quantify Cu thickness after etching or planarizing
Verify Cu plating thickness on PCB surfaces
SRP-T1 Replaceable Probe Tip - no recalibration necessary
Spare SRP-T1 ensures no factory downtime
Illuminated probe tip for easy positioning on copper traces
User Interface available in both English and Simplified Chinese