The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.
The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry. The package consists of a CPU unit, a probe and NIST traceable calibration standards. The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring user-replaceable measurement tips for the standard (CMI760, SRP-4) or narrow (CMI760N, SRP-4N) varieties.
Measure copper thickness on PCBs
Measure foil or laminated copper thickness in mils, µm or copper weight (oz)
Determine electroless or electroplated Cu thickness on PCBs
Accurately quantify copper thickness after etching or planarizing
Verify copper plating thickness on PCB surface
Measure copper thickness on PCBs
Measure foil or laminated copper thickness in mils, µm or copper weight (oz)
Determine electroless or electroplated Cu thickness on PCBs
Accurately quantify copper thickness after etching or planarizing
Verify copper plating thickness on PCB surface